SWEMCO’s production philosophy supports a variety of engagement protocols, such as kanban, consignment, dock-to-stock, JIT, etc., allowing SWEMCO to adapt to the Customer’s preferred method of engagement. Using state-of-the-art documentation and configuration control systems, the SWEMCO production facilities are ideally suited to manufacture a mix of mechanical and electronic component assembly ranging from printed circuit board assemblies to modules to subsystems to top-level integration.

Production Equipment

  • Automated and Semi Automatic Screen Printers
  • Automated and Semi Automatic SMT Equipment
  • Automated Through Hole Equipment (Sequencer, Radial, Axial and Dip)
  • Five and Ten Zone Convection Reflow Ovens
  • Computer Controlled Wave Solder and Selective Solder


  • Automated Optical Inspection (AOI)
  • Temperature Cycling Equipment
  • In-Circuit Test (GENRAD and Teradyne)
  • BGA / MBGA Rework and Repair Stations
  • X-Ray Equipment
  • Ionic Contamination Analysis     
    (Cleanliness Testing)

Assembly Technologies

  • RF, Backplane Assembly
  • Power Devices, Ground Planes, Magnetic Assemblies


  • Fine Pitch
  • Non-Rectangular Geometries
  • BGA and X-Ray Capabilities

Quality Certifications

  • ISO 9001:2015 Certified
  • ISO 13485:2016 Certified
  • AS 9100:D Certified
  • ITAR Registered
  • FDA Registered Contract Manufacturer: Registration Number 2522759
  • IPC-A-610 Class III Certified Instructors and Technicians


  • IPC ANSI/J-STD-001 Certified Instructors and Technicians
  • MIL-I-45208A Compliant
  • MIL STD-2000 Compliant
  • MIL STD-Q-9858A Compliant
  • Statistical Process Control (SPC)