equipment list

Stencil Printers:
DEK - Model Europa Fully-Automatic Stencil Printer (Qty-1)
DEK - Model ELA Fully-Automatic Stencil Printer (Qty-2)
DEK - Model HORIZON 265 Fully-Automatic Stencil Printer (Qty-1)

  • High resolution camera and optics combination provides the ability to view the screen and board fiducials simultaneously and conducts an automatic alignment for every print to ensure optimum process control
  • Dual-Flo Squeegee - Stepper motor controlled and fully programmable squeegee mechanism, single action pressure transducer to ensure consistent print thickness in both directions
  • Vacuum Under Screen Cleaner - Fully programmable screen cleaning enables fine pitch runs with the minimum operator intervention
  • Event logging, is part of the extensive Management Information System
  • Infra Red Keyboard/Mouse links
  • True vertical motion table for precise board/stencil separation.
  • Motorized alignment positioning, actuator resolution within 0.01mm (0.00037 inches)
  • Maximum 29”x29” stencil frame
  • Maximum 20”x20” print area

Pick And Place Equipment:
Universal Instruments – Genesis Series I GC-30S High Speed SMT Assembler (Qty-2)

  • Single-beam Dual-drive overhead gantry system
  • VRM linear motor positioning system
  • One 30-spindle rotary Lighting placement head
  • Dual on the head camera optics
  • Placement rates up to 34,400 CPH
  • Component range: 01005 – 30mmx30mm, 6mm max. Height
  • Maximum board size 20x20 W/O board shuttle
  • Maximum of 64 dual lane 8mm tape feeders – 128 components inputs
  • Docking feeder carts for fast change overs
  • IQ feeder system for component verification

Universal Instruments – Genesis Series I GX-7S Multi-function SMT Assembler (Qty-2)

  • Single-beam Dual-drive overhead gantry system
  • VRM linear motor positioning system
  • One 7-spindle In-Line placement head
  • Magellan Fire-Wire Upward looking camera
  • Placement rates up to 15,300 CPH
  • Component range: 01005 – 55mmx55mm SFoV
  • Maximum board size 20x20 W/O board shuttle
  • Maximum of 62 dual lane 8mm tape feeders – 132 components inputs
  • Docking feeder carts for fast change overs
  • IQ feeder system for component verification
  • PTF – Platform Tray Feeder allows 58 unique tray fed components

Quad Systems - QSP-2 High Speed SMT Assembler (Qty-2)

  • Dual gantry design provides placement rates up to 12,000 CPH takt time
  • Handles board sizes from 3.2” x 3” to 15” x 18”
  • Quad-align - In-process touch less centering from 0402 through 2.2” square
  • Innovative P 4 (Pick-Pick, Place-Place) head technology
  • Vertical lead alignment for fine pitch components
  • Exclusive QSOFT-2 operating software with centralized database
  • 0.3mm ultra-fine pitch capable utilizing the VU-8 Camera
  • BGA, SuperBGA, and MicroBGA capable
  • 0.5mm ultra-fine pitch capable - on the fly
  • Capacity - 136 8mm electronic tape feeders

Reflow Ovens:
Vitronics-Soltec - Model XPM3i-1030 Convection Reflow Oven (Qty-1)

  • 10 active heating and 3 active cooling zones
  • 22” Maximum board width
  • Closed loop transport system with Combination belt-rail transport system
  • Computer controlled chain lubrication system
  • Polar-cool closed loop active cooling
  • Kic auto-profile software
  • Nitrogen switching allows for either air or nitrogen operation.
  • Menu-driven software offers maximum flexibility in a true multi-tasking environment
  • Operator point-and-click graphical interface displays all operating conditions

Vitronics Soltec - Model XPM-820 Convection Reflow Oven (Qty-2)

  • 8 active heating and 2 cooling zones
  • 18” Maximum board width
  • Closed loop transport system with Combination belt-rail transport system
  • Computer controlled chain lubrication system
  • Menu-driven software offers maximum flexibility in a true multi-tasking environment.
  • Operator point-and-click graphical interface displays all operating conditions.

Vitronics Soltec - Model XPM-520A Convection Reflow Oven (Qty-1)

  • 5 active heating and 2 cooling zones
  • 18” Maximum board width
  • Closed loop transport system with Combination belt-rail transport system
  • Computer controlled chain lubrication system
  • Menu-driven software offers maximum flexibility in a true multi-tasking environment.
  • Operator point-and-click graphical interface displays all operating conditions.

Thermal Profiling Equipment:
KIC - SlimKIC 2000 Thermal Profiler

  • 9 data channels for total board coverage
  • RF module for simultaneous real-time data logging on a remote computer.
  • Auto profiling software

Automated Through Hole Equipment:
Universal Instruments - 6241B Variable Center Distance Axial Inserter (Qty-1)

  • 80 component stations.
  • Rotating table.

Contact Systems - CS400x Semi-Automatic Component Inserter (Qty-5)

  • 19.75” x 14” Insertion area.
  • 90 component sequential and random access feed system.
    Adjustable cut and clinch mechanism allows users to mechanically adjust lead length and clinch angle.

Wave Solder Equipment:
Technical Devices - NU/ERA JR. Wave solder machine

  • Foam Fluxer Module.
  • 30” long pre-heat module with closed loop temperature control.
  • Bi-directional laminar flow solder wave.
  • 16” maximum board width.

Selective Solder:
Pillarhouse - Jade Handex Selective solder machine (Qty-1)

  • Dual rotating Adjustable tool carriers for boards up to 20”x18”
  • Drop-Jet Fluxer for precision flux application
  • Full Nitrogen soldering atmosphere
  • Closed loop solder wave height control
  • Lead-free process soldering capable
  • 150mm selective wave option

Pillarhouse - Jade S-200 Selective solder machine (Qty-1)

  • Adjustable tool carrier for boards up to 20”x18”
  • Drop-Jet fluxer for precision flux application
  • Full Nitrogen soldering atmosphere
  • Closed loop solder wave height control
  • Both leaded and lead-free process soldering capable

APS – Gold-Wave GW-10 Rework Solder Fountain (Qty-1)

  • Microprocessor based, digital controller regulates:
  • Solder temperature, wave height, solder flow
  • Duration, and “blow-thru” duration

Surface Mount Repair / Rework Equipment:
DEN-On Instruments - RD500 Series2 BGA/CSP closed loop rework station
Metcal - QX2-P-II SMT/BGA Repair Station (Qty-1)

Inspection:
Phoenix X-ray - PCBA Analyser 160 (Qty-1)

  • Used for Ball Grid Array (BGA) inspection as well as Surface Mount (SMT) joint evaluation
  • 160 kv Max. X-ray source
  • 1 micron detail detectability
  • 2060x max. Geometric magnification
  • 128000x total magnification
  • 61 degree max oblique viewing angle
  • Fully programmable w/automated BGA inspection

YESTech - YTV-2050 AOI Inspection System (Qty-1)

  • Automated Optical Inspection of surface mount and through-hole boards.
  • Verifies missing, misaligned, and backward components.
  • Provides inspection of solder joints.

YESTech - B2 Bench Top AOI Inspection System (Qty-2)

Cyber-Optics - LSM2 Solder Paste Inspection System (Qty-1)

  • Measures Height, Length, Width, Area, Volume and Averages of solder paste.
  • Live video image of measurement site.
  • Data can be saved to diskette or transmitted via serial port.

ERSA - ERSAScope 2 Inspection System (Qty-1)

  • Endoscope capable of inspecting BGA and CSP solder joints
  • 0 degree look down head for leaded component inspection
  • Standard BGA inspection head
  • Flip-chip inspection head foe low standoff components
  • Image doc2 software pack for inspection library creation

Vision Engineering - LYNX Stereo Dynascope (40x mag.) (Qty-3)
Vision Engineering - TS-4 Stereo Dynascope (40x mag.) (Qty-4)
Vision Engineering - Mantis Microscopes(Qty-7)
Generic Microscopes - (Qty-4)

Cleaning / Cleanliness Testing Equipment:
Westek - Triton IV Aqueous Cleaner (Closed loop w/DI)

  • 4 stage cleaning
  • Twin turbine air knifes
  • 24” wide conveyor
  • Adjustable wash and rinse temperatures
  • Adjustable conveyor speed

SCS – Ionograph 500M STD

  • Dynamic testing method, offers state of the art accuracy for many applications
  • Compliance with specifications including MIL-STD-2000A, IPC-TM-650 and ANSI/J-STD-001
  • Control of aqueous and semi aqueous cleaning process for bare and assembled printed circuit boards
  • Used to control both the cleaning and the no-clean processes
  • Testing to prevent corrosion or product performance problems associated with ionic contamination
  • Cleanliness testing of performance sensitive small parts
  • Cleanliness testing of clean-room specific products such as gloves, fixtures, assembly tools and critical
  • Assembly components used in precise manufacturing
  • Process control of no clean/low residue processes, including spray fluxer set up and monitoring

Test Equipment:
GENRAD - Model 2286i In-Circuit Tester (Qty - 1)

  • 240 Real / 1920 Multiplexed hybrid Pins, Expandable to 3,840 pins.
  • In-Circuit Analog Module (ICA).
  • Analog Functional Test Module (AFTM).
  • Deep Serial Memory (DSM).

Seica – Pilot VIP Flying Probe Tester (Qty - 1)

  • 4 – Active topside flying probes
  • 1 – Openfix Capacitance probe
  • Utilizes “fixed” non-moving probe on the bottom side of the board
  • 24” x 24” test area
  • ATE rack can hold up to 1032 analog channels

Takaya - APT - 9401 CJ Flying Probe (Qty - 1)    
Checksum - Model TR-8 MDA Tester (Qty - 1)

  • Can test for: Continuity (opens/shorts), Resistors, Capacitors (including polarity in some cases), Inductors, Semiconductor junctions, Transistor/FET beta and on-off switching, Voltages, SMT connections for opens, Transformer polarity, Relay actuation.
  • Boundary-Scan.
  • Top and Bottom Probing Fixture Systems.
  • Quick Change Fixtures.
  • Up to 8000 test points.

Tektronix - TLA715 Series Logic Analyzer

  • 272 channels at 16MB Depth.
  • 500 psec. resolution with glitch capture.
  • 100 MHz state display.
  • Code Disassembly for popular microprocessors via personality options.
  • Capture and compare capability to debug via golden board.

Environmental Test Equipment:
ESPEC Model ENZ28-15C Environmental Test Chamber