
equipment list
Stencil Printers:
DEK - Model Europa Fully-Automatic Stencil Printer (Qty-1)
DEK - Model ELA Fully-Automatic Stencil Printer (Qty-2)
DEK - Model HORIZON 265 Fully-Automatic Stencil Printer (Qty-1)
- High resolution camera and optics combination provides the ability to view the screen and board fiducials simultaneously and conducts an automatic alignment for every print to ensure optimum process control
- Dual-Flo Squeegee - Stepper motor controlled and fully programmable squeegee mechanism, single action pressure transducer to ensure consistent print thickness in both directions
- Vacuum Under Screen Cleaner - Fully programmable screen cleaning enables fine pitch runs with the minimum operator intervention
- Event logging, is part of the extensive Management Information System
- Infra Red Keyboard/Mouse links
- True vertical motion table for precise board/stencil separation.
- Motorized alignment positioning, actuator resolution within 0.01mm (0.00037 inches)
- Maximum 29”x29” stencil frame
- Maximum 20”x20” print area
Pick And Place Equipment:
Universal Instruments – Genesis Series I GC-30S High Speed SMT Assembler (Qty-2)
- Single-beam Dual-drive overhead gantry system
- VRM linear motor positioning system
- One 30-spindle rotary Lighting placement head
- Dual on the head camera optics
- Placement rates up to 34,400 CPH
- Component range: 01005 – 30mmx30mm, 6mm max. Height
- Maximum board size 20x20 W/O board shuttle
- Maximum of 64 dual lane 8mm tape feeders – 128 components inputs
- Docking feeder carts for fast change overs
- IQ feeder system for component verification
Universal Instruments – Genesis Series I GX-7S Multi-function SMT Assembler (Qty-2)
- Single-beam Dual-drive overhead gantry system
- VRM linear motor positioning system
- One 7-spindle In-Line placement head
- Magellan Fire-Wire Upward looking camera
- Placement rates up to 15,300 CPH
- Component range: 01005 – 55mmx55mm SFoV
- Maximum board size 20x20 W/O board shuttle
- Maximum of 62 dual lane 8mm tape feeders – 132 components inputs
- Docking feeder carts for fast change overs
- IQ feeder system for component verification
- PTF – Platform Tray Feeder allows 58 unique tray fed components
Quad Systems - QSP-2 High Speed SMT Assembler (Qty-2)
- Dual gantry design provides placement rates up to 12,000 CPH takt time
- Handles board sizes from 3.2” x 3” to 15” x 18”
- Quad-align - In-process touch less centering from 0402 through 2.2” square
- Innovative P 4 (Pick-Pick, Place-Place) head technology
- Vertical lead alignment for fine pitch components
- Exclusive QSOFT-2 operating software with centralized database
- 0.3mm ultra-fine pitch capable utilizing the VU-8 Camera
- BGA, SuperBGA, and MicroBGA capable
- 0.5mm ultra-fine pitch capable - on the fly
- Capacity - 136 8mm electronic tape feeders
Reflow Ovens:
Vitronics-Soltec - Model XPM3i-1030 Convection Reflow Oven (Qty-1)
- 10 active heating and 3 active cooling zones
- 22” Maximum board width
- Closed loop transport system with Combination belt-rail transport system
- Computer controlled chain lubrication system
- Polar-cool closed loop active cooling
- Kic auto-profile software
- Nitrogen switching allows for either air or nitrogen operation.
- Menu-driven software offers maximum flexibility in a true multi-tasking environment
- Operator point-and-click graphical interface displays all operating conditions
Vitronics Soltec - Model XPM-820 Convection Reflow Oven (Qty-2)
- 8 active heating and 2 cooling zones
- 18” Maximum board width
- Closed loop transport system with Combination belt-rail transport system
- Computer controlled chain lubrication system
- Menu-driven software offers maximum flexibility in a true multi-tasking environment.
- Operator point-and-click graphical interface displays all operating conditions.
Vitronics Soltec - Model XPM-520A Convection Reflow Oven (Qty-1)
- 5 active heating and 2 cooling zones
- 18” Maximum board width
- Closed loop transport system with Combination belt-rail transport system
- Computer controlled chain lubrication system
- Menu-driven software offers maximum flexibility in a true multi-tasking environment.
- Operator point-and-click graphical interface displays all operating conditions.
Thermal Profiling Equipment:
KIC - SlimKIC 2000 Thermal Profiler
- 9 data channels for total board coverage
- RF module for simultaneous real-time data logging on a remote computer.
- Auto profiling software
Automated Through Hole Equipment:
Universal Instruments - 6241B Variable Center Distance Axial Inserter (Qty-1)
- 80 component stations.
- Rotating table.
Contact Systems - CS400x Semi-Automatic Component Inserter (Qty-5)
- 19.75” x 14” Insertion area.
- 90 component sequential and random access feed system.
Adjustable cut and clinch mechanism allows users to mechanically adjust lead length and clinch angle.
Wave Solder Equipment:
Technical Devices - NU/ERA JR. Wave solder machine
- Foam Fluxer Module.
- 30” long pre-heat module with closed loop temperature control.
- Bi-directional laminar flow solder wave.
- 16” maximum board width.
Selective Solder:
Pillarhouse - Jade Handex Selective solder machine (Qty-1)
- Dual rotating Adjustable tool carriers for boards up to 20”x18”
- Drop-Jet Fluxer for precision flux application
- Full Nitrogen soldering atmosphere
- Closed loop solder wave height control
- Lead-free process soldering capable
- 150mm selective wave option
Pillarhouse - Jade S-200 Selective solder machine (Qty-1)
- Adjustable tool carrier for boards up to 20”x18”
- Drop-Jet fluxer for precision flux application
- Full Nitrogen soldering atmosphere
- Closed loop solder wave height control
- Both leaded and lead-free process soldering capable
APS – Gold-Wave GW-10 Rework Solder Fountain (Qty-1)
- Microprocessor based, digital controller regulates:
- Solder temperature, wave height, solder flow
- Duration, and “blow-thru” duration
Surface Mount Repair / Rework Equipment:
DEN-On Instruments - RD500 Series2 BGA/CSP closed loop rework station
Metcal - QX2-P-II SMT/BGA Repair Station (Qty-1)
Inspection:
Phoenix X-ray - PCBA Analyser 160 (Qty-1)
- Used for Ball Grid Array (BGA) inspection as well as Surface Mount (SMT) joint evaluation
- 160 kv Max. X-ray source
- 1 micron detail detectability
- 2060x max. Geometric magnification
- 128000x total magnification
- 61 degree max oblique viewing angle
- Fully programmable w/automated BGA inspection
YESTech - YTV-2050 AOI Inspection System (Qty-1)
- Automated Optical Inspection of surface mount and through-hole boards.
- Verifies missing, misaligned, and backward components.
- Provides inspection of solder joints.
YESTech - B2 Bench Top AOI Inspection System (Qty-2)
Cyber-Optics - LSM2 Solder Paste Inspection System (Qty-1)
- Measures Height, Length, Width, Area, Volume and Averages of solder paste.
- Live video image of measurement site.
- Data can be saved to diskette or transmitted via serial port.
ERSA - ERSAScope 2 Inspection System (Qty-1)
- Endoscope capable of inspecting BGA and CSP solder joints
- 0 degree look down head for leaded component inspection
- Standard BGA inspection head
- Flip-chip inspection head foe low standoff components
- Image doc2 software pack for inspection library creation
Vision Engineering - LYNX Stereo Dynascope (40x mag.) (Qty-3)
Vision Engineering - TS-4 Stereo Dynascope (40x mag.) (Qty-4)
Vision Engineering - Mantis Microscopes(Qty-7)
Generic Microscopes - (Qty-4)
Cleaning / Cleanliness Testing Equipment:
Westek - Triton IV Aqueous Cleaner (Closed loop w/DI)
- 4 stage cleaning
- Twin turbine air knifes
- 24” wide conveyor
- Adjustable wash and rinse temperatures
- Adjustable conveyor speed
SCS – Ionograph 500M STD
- Dynamic testing method, offers state of the art accuracy for many applications
- Compliance with specifications including MIL-STD-2000A, IPC-TM-650 and ANSI/J-STD-001
- Control of aqueous and semi aqueous cleaning process for bare and assembled printed circuit boards
- Used to control both the cleaning and the no-clean processes
- Testing to prevent corrosion or product performance problems associated with ionic contamination
- Cleanliness testing of performance sensitive small parts
- Cleanliness testing of clean-room specific products such as gloves, fixtures, assembly tools and critical
- Assembly components used in precise manufacturing
- Process control of no clean/low residue processes, including spray fluxer set up and monitoring
Test Equipment:
GENRAD - Model 2286i In-Circuit Tester (Qty - 1)
- 240 Real / 1920 Multiplexed hybrid Pins, Expandable to 3,840 pins.
- In-Circuit Analog Module (ICA).
- Analog Functional Test Module (AFTM).
- Deep Serial Memory (DSM).
Seica – Pilot VIP Flying Probe Tester (Qty - 1)
- 4 – Active topside flying probes
- 1 – Openfix Capacitance probe
- Utilizes “fixed” non-moving probe on the bottom side of the board
- 24” x 24” test area
- ATE rack can hold up to 1032 analog channels
Takaya - APT - 9401 CJ Flying Probe (Qty - 1)
Checksum - Model TR-8 MDA Tester (Qty - 1)
- Can test for: Continuity (opens/shorts), Resistors, Capacitors (including polarity in some cases), Inductors, Semiconductor junctions, Transistor/FET beta and on-off switching, Voltages, SMT connections for opens, Transformer polarity, Relay actuation.
- Boundary-Scan.
- Top and Bottom Probing Fixture Systems.
- Quick Change Fixtures.
- Up to 8000 test points.
Tektronix - TLA715 Series Logic Analyzer
- 272 channels at 16MB Depth.
- 500 psec. resolution with glitch capture.
- 100 MHz state display.
- Code Disassembly for popular microprocessors via personality options.
- Capture and compare capability to debug via golden board.
Environmental Test Equipment:
ESPEC Model ENZ28-15C Environmental Test Chamber